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Alloy used to join metal pieces
Solder (UK: /ˈsɒldə, ˈsəʊldə/; NA: /ˈsɒdər/) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order
Solder
Mathematical construct of fiber bundles
mathematics, more precisely in differential geometry, a soldering (or sometimes solder form) of a fiber bundle to a smooth manifold is a manner of attaching
Solder_form
Process of joining metal pieces with heated filler metal
Soldering (US: /ˈsɒdərɪŋ/; UK: /ˈsoʊldərɪŋ/) joins two metal surfaces using a filler metal called solder. The surfaces are heated, melting the solder
Soldering
Principal bundle associated to a vector bundle
of a vector-valued 1-form on F M {\displaystyle FM} called the solder form (also known as the fundamental or tautological 1-form). Let x {\displaystyle
Frame_bundle
Math/physics concept
The main tensorial invariant of a connection form is its curvature form. In the presence of a solder form identifying the vector bundle with the tangent
Connection_form
Field theory of a point particle confined to move on a fixed manifold
∗ M {\displaystyle T^{*}M} and solders them together, in that d ϕ {\displaystyle \mathrm {d} \phi } is a solder form. In this sense, the interpretation
Sigma_model
Hand tool for soldering
A soldering iron is a hand tool used in soldering. It supplies heat to melt solder so that it can flow into the joint between two workpieces. A soldering
Soldering_iron
Material used in the manufacture of printed circuit boards
Solder paste is a preparation of powdered solder in sticky flux paste primarily used to solder surface mount components onto printed circuit boards. It
Solder_paste
Metallic material
Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical
Solder_alloys
Chemical used in metallurgy for cleaning or purifying molten metal
oxidation. For example, tin-lead solder attaches very well to copper metal, but poorly to its oxides, which form quickly at soldering temperatures. By preventing
Flux_(metallurgy)
Metalworking measure
The solderability of a substrate is a measure of the ease with which a soldered joint can be made to that material. Good solderability requires wetting
Solderability
Layer of polymer applied to printed circuit boards
protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads. A solder bridge is an unintended electrical connection
Solder_mask
Connection method for surface-mounted chips
of solder balls—for example, one layer of solder balls attaching a flip chip to an interposer to form a BGA package, and a second layer of solder balls
Solder_ball
Canonical differential form
solder form. By convention, one uses the phrase "canonical form" whenever the form has a unique, canonical definition, and one uses the term "solder form"
Tautological_one-form
Mathematics concept
The horizontal bundle is the kernel of the connection form. The solder form or tautological one-form vanishes on the vertical bundle and is non-zero only
Vertical and horizontal bundles
Vertical_and_horizontal_bundles
Generalization of affine connections
principal bundle is tied to the geometry of the base manifold using a solder form. Cartan connections describe the geometry of manifolds modelled on homogeneous
Cartan_connection
Structure group sub-bundle on a tangent frame bundle
piece of data on the underlying G-bundle of a G-structure: the solder form. The solder form is what ties the underlying principal bundle of the G-structure
G-structure_on_a_manifold
Electronics soldering process
Wave soldering is a bulk soldering process used in printed circuit board manufacturing. The circuit board is passed over a pan of molten solder in which
Wave_soldering
Degradation of solder due to deformation under cyclic loading
Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading. This can often occur at stress levels below the yield stress
Solder_fatigue
a basic soldering form on Y → X. Due to the canonical vertical splitting VY = Y × Y, this soldering form is brought into a vector-valued form σ = σ λ
Connection_(affine_bundle)
Solder by immersion in a bath of molten solder
Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly
Dip_soldering
Object in differential geometry
+\omega \wedge \theta } where θ {\displaystyle \theta } is the solder form (tautological one-form). The subscript ω {\displaystyle \omega } serves only as a
Contorsion_tensor
Object in differential geometry
{\displaystyle D\mathbf {e} _{i}=\mathbf {e} _{j}{\omega ^{j}}_{i}.} The solder form for the tangent bundle (relative to this frame) is the dual basis θi
Torsion_tensor
Approach to general relativity
being unnecessary for the specification of a tetrad. Each covector is a solder form. From the point of view of the differential geometry of fiber bundles
Tetrad_formalism
Ultrasonic soldering (U/S soldering) is a flux-less soldering process that uses ultrasonic energy, without the need for chemicals to solder materials,
Ultrasonic_soldering
Power tool for soldering metals
A soldering gun is an approximately pistol-shaped, electrically powered tool for soldering metals using tin-based solder to achieve a strong mechanical
Soldering_gun
Concept in mathematics
structure of the solder form θ, which is an equivariant Rn-valued 1-form on P, should be taken into account. In particular, the torsion form on P, is an Rn-valued
Connection_(principal_bundle)
Printed circuit board solder process
Stencil printing is the process of depositing solder paste on the printed circuit boards (PCBs) to establish electrical connections. It is immediately
Stencil_printing
American company
across the tip; e.g. metallic contacts, or solder. With a current flowing, the resistance of both the solder and the tip produces enough heat to increase
ColdHeat
Gauge theory with affine connections
connection Γ {\displaystyle \Gamma } and the soldering form σ {\displaystyle \sigma } (6). In this case, the soldering form σ {\displaystyle \sigma } (6) often
Affine_gauge_theory
Phenomenon in electrical devices
pure, or almost pure, tin solder in their production. It was noticed that small metal hairs or tendrils grew between metal solder pads, causing short circuits
Whisker_(metallurgy)
Method for producing electronic circuits
without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless
Surface-mount_technology
Attempt to extend Yang–Mills theory to gravity
+\Theta } of a linear world connection Γ {\displaystyle \Gamma } and a soldering form Θ = Θ μ a d x μ ⊗ ϑ a {\displaystyle \Theta =\Theta _{\mu }^{a}dx^{\mu
Gauge_gravitation_theory
Form of soldered joint used
wiped joint is a form of soldered joint used to join lead pipework. The defining characteristic of a wiped joint is that the soldering process involves
Wiped_joint
Soldering defect
Insufficient solder is a soldering defect in which the amount of solder forming the joint is inadequate to ensure proper mechanical and electrical integrity
Insufficient_solder
Surface-mount packaging that uses an array of solder balls
molten solder to hold the package in alignment with the circuit board, at the correct separation distance, while the solder cools and solidifies, forming soldered
Ball_grid_array
Board to support and connect electronic components
components may be fixed to conductive pads on the outer layers, generally by soldering, which both electrically connects and mechanically fastens the components
Printed_circuit_board
Defines a notion of parallel transport on a bundle
equals the dimension of M {\displaystyle M} and a solder form has been chosen, one can use the soldering to interchange the indices and define a notion of
Connection_(vector_bundle)
Machine used in circuit board production
reflow soldering of surface mount electronic components to printed circuit boards (PCBs). In commercial high-volume use, reflow ovens take the form of a
Reflow_oven
Coating process used on printed circuit boards
Organic solderability preservative or OSP is a method for coating of printed circuit boards. It uses a water-based organic compound that selectively bonds
Organic solderability preservative
Organic_solderability_preservative
Standard for miniature computer expansion cards
having permanently soldered single-sided modules. In 2017, Samsung introduced a new form factor called Next Generation Small Form Factor (NGSFF), also
M.2
Type of electronics manufacturing
drilled. The final assembly involves placing components onto the PCB and soldering them in place. This process can include through-hole technology (in which
Printed circuit board manufacturing
Printed_circuit_board_manufacturing
French mathematician (1905–1979)
of fiber bundle, and the related notions of Ehresmann connection and solder form, building on the works by Herbert Seifert and Hassler Whitney in the
Charles_Ehresmann
Construct allowing differentiation of tangent vector fields of manifolds
defined by parallel transport. The frame bundle also comes equipped with a solder form θ : T(FM) → Rn which is horizontal in the sense that it vanishes on vertical
Affine_connection
Technique that flips a microchip upside down to connect it
removed or stripped. Then the solder on the chips undergoes solder reflow to form the bumps into their final shape. Solder balls are often 75 to 500 microns
Flip_chip
Generalization of an ordered basis of a vector space
cotangent bundle; i.e. given by forms). The tautological one-form is a special case of the more general solder form, which provides a (co-)frame field
Moving_frame
2003 European Union directive on hazardous materials
between lead-containing and lead-free solder pastes is the "flow" of the solder in its liquid state. Lead-containing solder has a lower surface tension, and
RoHS
Metal plating process
of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes. It consists of an electroless
Electroless nickel immersion gold
Electroless_nickel_immersion_gold
Soldering filter
the soldering process. These devices take many forms depending on the project size and application, from small ductwork to entire fume hoods. Solder itself
Fume_extractor_(soldering)
Operation on fibered manifolds
horizontal tangent-valued one-form on Y which projects onto the canonical tangent-valued form (tautological one-form or solder form) θ X = d x μ ⊗ ∂ μ {\displaystyle
Connection_(fibered_manifold)
Technique for decorating jewelry
soldering metal items together exploits the capillary action of solder with a lower melting point flowing between the items to be bonded. Soldering is
Granulation_(jewellery)
Coating an object with a thin layer of gold
their liquid state, forming brittle intermetallics. When eutectic 63% tin – 37% lead solder is used, no lead-gold compounds are formed, because gold preferentially
Gold_plating
Device used to join electrical conductors
users can connect a cable to a stationary device PCB mount connectors soldered to a printed circuit board, providing a point for cable or wire attachment
Electrical_connector
Metal-joining technique
Brazing differs from soldering through the use of a higher temperature. The principle of joining with filler metal is the same, but solder has a specific composition
Brazing
Electrical installation of cabling
form of insulated cable, introduced in 1896, consisted of two impregnated-paper-insulated conductors in an overall lead sheath. Joints were soldered,
Electrical_wiring
Wafer bond with glass central layer
Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It
Glass_frit_bonding
Chemical element with atomic number 83 (Bi)
recycled from the soldered joints in electronic equipment. Recent efficiencies in solder application in electronics mean substantially less solder is deposited
Bismuth
Simplest carboxylic acid (HCOOH)
capacity to reduce oxide layers, formic acid gas can be blasted at an oxide surface to increase solder wettability. Formic acid is used as a volatile pH
Formic_acid
point in the conformal sphere (a null line in Rn+1,1) such that the solder form induced by these data is an isomorphism. E. Cartan, "Les espaces à connexion
Conformal_connection
Type of metal tubing
gas, and the solder is melted into the connection. When the solder cools, it forms a very strong bond that can last for decades. Solder-connected rigid
Copper_tubing
Mixture of hydrogen and nitrogen
stores. It is sometimes used as a reducing agent for high-temperature soldering and brazing, to remove oxidation of the joint without the use of flux
Forming_gas
The most common application of the Bi-In alloy is as a low temperature solder, which can also contain, besides bismuth and indium, lead, cadmium, and
Bismuth–indium
German semiconductor company
intelligent power module for solder-free assembly 2008 SKYPER with fully digital signal processing 2007 SKiM 100% solder-free IGBT modules for hybrid
Semikron
Thermoelectric Copper Device
material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip
Thermal_copper_pillar_bump
Additive process used to make a 3D object
the image is defined, the material must get coated with a solder mask for later soldering. Nomenclature is then added so components can be identified
3D_printing
Common sample preparation technique in electronics
analysis. Printed wiring boards (PWBs) and electronic components and their solder joints are common cross sectioned samples. The features of interest to be
Cross_section_(electronics)
Metal added to join two other metal parts
through welding, brazing, or soldering. Soldering and brazing processes rely on a filler metal added to the joint to form the junction between the base
Filler_metal
Personal computer for mobile use
or memory soldered to the motherboard is highly variable. When removable, most laptops use SO-DIMM slots in which RAM is mounted. A new form factor, the
Laptop
Material for prototyping electronic circuits
or miniature point to point wiring techniques. Discrete components are soldered to the prototype board such as resistors, capacitors, and integrated circuits
Perfboard
Type of transport in differential geometry
group to the stabilizer of a point in projective space such that the solder form induced by these data is an isomorphism. It is also possible to use PGL(n+1
Projective_connection
Semiconductor light source
ratings range from around 1 mA to above 20 mA. LED's can be soldered to a flexible PCB strip to form LED tape popularly used for decoration. Common package
Light-emitting_diode
Medical condition
copper, or cadmium. In extreme cases, cadmium (present in some older silver solder alloys) can cause loss of consciousness. The signs and symptoms are generally
Metal_fume_fever
Deterioration of tin objects at low temperature
regulations in Europe, and similar regulations elsewhere, traditional lead/tin solder alloys in electronic devices have been replaced by nearly pure tin, introducing
Tin_pest
Making an electronic circuit by directly connecting the leads of the components
invention was to apply soldering to electrical assembly. In soldering, an alloy of tin and lead (and/or other metals), known as solder, is melted and adheres
Point-to-point_construction
Chemical element with atomic number 51 (Sb)
antimony are in alloys with lead and tin, which have improved properties for solders, bullets, and plain bearings. It improves the rigidity of lead-alloy plates
Antimony
Easily fused metal alloy
below 183 °C (361 °F; 456 K). Fusible alloys in this sense are used for solder. Fusible alloys are typically made from low melting metals. There are 14
Fusible_alloy
Tool for soldering with lead-tin alloys
The "Scope" soldering iron is a tool for soldering with lead-tin alloys, made in Australia since 1950, and intended for occasional or intermittent use
Scope_soldering_iron
Japanese mixed-metal laminate
form liquid phase diffusion bonds with one another without completely melting. This was useful in the traditional techniques of fusing and soldering the
Mokume-gane
Matrices used for Lorentz group spinors
\sigma ^{\mu }{}_{\alpha {\dot {\beta }}}} can also be thought of as a soldering form for building a tangent vector out of a pair of left and right Weyl spinors
Infeld–Van der Waerden symbols
Infeld–Van_der_Waerden_symbols
Phyllosilicate mineral
and "glue" respectively, in allusion to the name of the material used to solder gold. The word was first used by Theophrastus in 315 BC. Chrysocolla has
Chrysocolla
American actor (born 1969)
plastic and either stitched together with copper wire or soldered, that he believes prove his new form of mathematics. Howard, Terrence [@terrencehoward] (November
Terrence_Howard
Method of joining electrical cable
better chance for solder to pass in between the wires". The book suggested the long tie variant more suited to splices where soldering was intended. However
Western_Union_splice
Main printed circuit board used for a computing device
CPU is directly soldered to the motherboard. Memory slots into which the system's main memory is to be installed, typically in the form of DIMM modules
Motherboard
Motherboard and power supply configuration
four pins connected to wires from a four-core cable. The wires are either soldered to the power button (making it difficult to replace the power supply if
ATX
Tubular section or hollow cylinder
into the connection. When the solder cools, it forms a very strong bond which can last for decades. Solder-connected rigid copper is the most popular choice
Pipe_(fluid_conveyance)
Computer storage device with no moving parts
chip package size to fit into compact subsystems, and that they can be soldered directly onto a system motherboard to reduce adverse effects from vibration
Solid-state_drive
Boron compound, a salt of boric acid
available in powder or granular form and has many industrial and household uses, including as a pesticide, as a metal soldering flux, as a component of glass
Borax
Mixture or metallic solid solution composed of two or more elements
silicon steel (iron with non-metallic carbon or silicon respectively), solder, brass, pewter, duralumin, bronze, and amalgams. Alloys are used in a wide
Alloy
Flash memory card format
If not, SPI can also be emulated by bit banging (e.g. a SD card slot soldered to a Linksys WRT54G-TM router and wired to GPIO pins using DD-WRT's Linux
SD_card
Joining two materials by deforming one or both to hold the other
processes involved in termination (soldered connections require aggressive cleaning, high heat, and possibly toxic solders) Potentially superior mechanical
Crimp_(joining)
Type of electrical conductor
"HowTo: Solder by hand - Flux and lead-free solder". JRE's Project Blog. Retrieved 14 April 2026. Copper dissolves a little bit in solder. With lead-free
Copper-clad_aluminium_wire
Material processing technology
zinc. The 20th century expanded uses to electronics, including flip-chip solder in the 1990s. Recent advances focus on nanostructures, alloys, and energy
Electrodeposition
Replaceable RAM form factor
DDR5 and LPDDR5(X). Before 2022, most laptops used either SO-DIMMs or soldered-on memory modules. SO-DIMMs were developed in 1997 as a size-reduced version
CAMM_(memory_module)
Chemical element with atomic number 50 (Sn)
Tin has long been used in alloys with lead as solder, in amounts of 5 to 70% w/w. Tin with lead forms a eutectic mixture at the weight proportion of
Tin
Technique used for in-circuit testing
for performing in-circuit testing (ICT). It makes use of small beads of solder placed onto the board's traces to allow measuring and controlling of the
Bead_probe_technology
intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that
List of electronic component packaging types
List_of_electronic_component_packaging_types
Desktop computer by Apple
at 167 MHz. The CPU can be overclocked to higher frequencies by either soldering or desoldering certain zero-ohm resistors on the logic board. An ATI Radeon
Mac_Mini
Fossilized tree resin
up by the waves in spring, it being an excretion of the sea in a concrete form; as, also, that the inhabitants use this amber by way of fuel, and sell it
Amber
Process of making items from metal
solidifies in the capillary, forming a strong joint. Unlike welding, the work piece is not melted. Brazing is similar to soldering, but occurs at temperatures
Metalworking
Small battery
arrangements. For example, there is a plug-in and a solder-in CR2032, a plug-in and three solder-in BR2330s in addition to CR2330s, and many rechargeables
Button_cell
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