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Technique that flips a microchip upside down to connect it
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices
Flip_chip
Historical electronic computer module design
Flip-Chip module A Flip-Chip module is a component of digital logic systems made by the Digital Equipment Corporation (DEC) for its PDP-7, PDP-8, PDP-9
Flip-Chip_module
Type of integrated circuit packaging
PGA packages use wire bonding when the chip is mounted on the pinned side, and flip chip construction when the chip is on the top side. Some PGA packages
Pin_grid_array
Connection method for surface-mounted chips
array, chip-scale package, and flip chip packages generally use solder balls. After the solder balls are used to attach an integrated circuit chip to a
Solder_ball
Method of circuit board manufacture
device) with the conductive traces of the printed circuit board. In "flip chip on board", the device is inverted, with the top layer of metallization
Chip_on_board
Integrated circuit package that is no or barely larger than the die it contains
are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC's standard J-STD-012, Implementation of Flip Chip and
Chip-scale_package
Electronic circuit with two stable states
Equipment Corporation's Logic Handbook Flip Chip™ Modules 1969 edition describes "R/S Flip-Flops" and 'Clocked' "R/S Flip-Flops" accompanied by a truth table
Flip-flop_(electronics)
Electronic circuit formed on a small, flat piece of semiconductor material
shrinks Peltier cooler, puts it in the chip package". Ars Technica. 10 January 2008. "Wire Bond Vs. Flip Chip Packaging". Semiconductor Digest. 10 December
Integrated_circuit
Thermoelectric Copper Device
embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging
Thermal_copper_pillar_bump
2021 Intel CPU socket
LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors based on Alder Lake and
LGA_1700
Electronic assembly containing multiple integrated circuits that behaves as a unit
conventional monolithic IC approach. A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses flip chip technology. A FCMCM may have one large
Multi-chip_module
CPU socket designed by Intel
LGA 7529 is a zero insertion force flip-chip land grid array (LGA) socket designed by Intel which supports the Sierra Forest line of E-core Xeon processors
LGA_7529
Taiwanese manufacturer of semiconductor testing products
ASE began volume production of wafer-level chip-scale packages. Flip chip is a method of flipping the chip to connect with either substrate or leadframe
ASE_Group
Surface-mount packaging that uses an array of solder balls
the "micro-FCBGA" (flip chip ball grid array) is Intel's current[when?] BGA mounting method for mobile processors that use a flip chip binding technology
Ball_grid_array
CPU socket designed by Intel
LGA 4710 is a zero insertion force flip-chip land grid array (LGA) socket designed by Intel that is used by Sierra Forest, a line of E-core only Xeon
LGA_4710
Final stage of semiconductor device fabrication
to manufacture. Wire bonding can be used instead of techniques such as flip-chip to reduce costs. For semiconductor, manufacturers usually print the manufacturer's
Integrated_circuit_packaging
CPU socket for Intel desktop processors
LGA 1200, also known as Socket H5, is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake
LGA_1200
Type of surface-mount packaging for integrated circuits
found on older Intel and AMD desktop processors, there are no pins on the chip; in place of the pins are pads of bare gold-plated copper that touch protruding
Land_grid_array
Integrated circuit packaging method
package substrate. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together and to the package substrate, or
System_in_a_package
Semiconductor light source
probing, dicing, die transfer from wafer to package, and wire bonding or flip chip mounting, perhaps using indium tin oxide, a transparent electrical conductor
Light-emitting_diode
CPU socket for AMD Ryzen processors with Zen architecture
Socket AM5 (LGA 1718) is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by AMD that is used for AMD Ryzen microprocessors
Socket_AM5
or component to another; see wire bonding, thermocompression bonding, flip chip, hybrid bonding, etc. breadboard – a construction base for prototyping
Glossary of microelectronics manufacturing terms
Glossary_of_microelectronics_manufacturing_terms
Intel microprocessor compatible socket for Nova Lake-S
2026-02-21. Shilov, Anton (2026-02-09). "Intel's new platform for Nova Lake chips leaked, up to 48 PCIe lanes and all-new chipset — 900-series motherboards
LGA_1954
Manufacturing process used to create integrated circuits
edges of the die, however, Flip-chip packaging can be used to place bond pads across the entire surface of the die. Chip scale package (CSP) is another
Semiconductor device fabrication
Semiconductor_device_fabrication
Intel CPU socket
LGA 1155, also called Socket H2, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for their CPUs based on the Sandy
LGA_1155
Intel motherboard socket for Haswell CPUs
LGA 1150, also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell
LGA_1150
American computer manufacturer (1957–1998)
circuits were then packaged as the first "R" (red) series "Flip-Chip" modules. Later, other Flip-Chip module series provided additional speed, much higher logic
Digital_Equipment_Corporation
Intel microprocessor compatible socket for Meteor Lake-PS and Arrow Lake-S
Release date October 24, 2024 Designed by Intel Type LGA-ZIF Chip form factors Flip-chip Contacts 1851 FSB protocol PCI Express Processor dimensions 37
LGA_1851
Errors and technical difficulties on Xbox 360
was caused by the cracking of high-lead C4 solder bumps inside the GPU flip chip package, connecting the GPU and eDRAM dies to the substrate interposer
Xbox_360_technical_problems
Intel microprocessor compatible socket
LGA 1151, also known as Socket H4, is a type of zero insertion force flip-chip land grid array (LGA) socket for Intel desktop processors which comes in
LGA_1151
2026 foldable smartphone by Samsung Electronics
Samsung Galaxy Z Flip 7. Although it is the eighth main device in the Samsung Galaxy Z Flip series, Samsung used both Snapdragon and Exynos chips in key markets
Samsung_Galaxy_Z_Flip_8
Removing the protective cover of an integrated circuit
interface material (TIM) Removed and flipped over center die before metallization etching; visible are pads for flip chip solder balls Die shot of the center
Decapping
Intel microprocessor series released in 2023
to use a chiplet architecture which means that the processor is a multi-chip module. Meteor Lake's design effort was led by Tim Wilson. In July 2021,
Meteor_Lake
CPU socket for AMD HEDT/workstation CPUs
Socket sTR5 Type LGA-ZIF Chip form factors Flip-chip Contacts 4,844 FSB protocol PCI Express, Infinity Fabric Processor dimensions 58.5mm × 75.4mm 4410
Socket_sTR5
CPU socket designed by Intel
LGA 4677 (Socket E) is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel, compatible with Sapphire Rapids server and
LGA_4677
Electrical connection
high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives
Through-silicon_via
Places a microchip on a flexible circuit board
advantage of TAB has diminished with the development of the flip chip manufacturing, because flip chip uses soldering which also with the time has developed
Tape-automated_bonding
Surface region for an electrical contact
system include soldering, wirebonding, or flip chip mounting. Contact pads are created alongside a chip's functional structure during the photolithography
Contact_pad
American semiconductor company
RF-antenna designs incorporated directly into or onto a chip, CMOS imaging sensors or flip chip packaging with copper pillar bumps. Amkor also offers wire
Amkor_Technology
Minicomputer introduced in 1964
Introduced in 1964, shipped starting in 1965, it was the first to use their Flip-Chip technology. With a cost of US$72,000, it was cheap but powerful by the
PDP-7
in 2013 for his development of three-dimensional multichip modules and flip chip interconnects. "2013 elevated fellow" (PDF). IEEE Fellows Directory. Archived
Wei_Hu_Koh
Microprocessor developed by Intel
0.25 μm Deschutes core of the Pentium II in a flip-chip package with a 512 kB full-speed L2 cache chip from the Pentium II Xeon into a Socket 8-compatible
Pentium_OverDrive
Material processing technology
tin, and zinc. The 20th century expanded uses to electronics, including flip-chip solder in the 1990s. Recent advances focus on nanostructures, alloys,
Electrodeposition
CPU socket for old Intel CPUs
Pentium III CPUs for Slot 1, which was created to accommodate the switch to flip chip packaging. Only the front plate was carried over; the coolers were now
Slot_1
Robotic machine
This type of equipment is sometimes used to package microchips using the flip chip method. The origins of pick-and-place automation can be traced back to
Pick-and-place_machine
packages 1997: VIEW 890 – A laser-based, 3D scanner system for bump-on-die (Flip chip) inspection 1999: VIEW Pinnacle 250 – A high-accuracy, machine vision-based
VIEW_Engineering
GPU used in the Xbox 360
underfill material with a low glass transition temperature (Tg) in the flip-chip packaging, which tended to become rubbery at typical operating temperatures
Xenos_(graphics_chip)
Processor family
models comprise two dies, each containing two cores, packaged in a multi-chip module. The Core 2 range is the last flagship range of Intel desktop processors
Intel_Core_2
Line of Intel microprocessors released in 2022
for the HX series, the processor and PCH are packaged together on a multi-chip package. The HX series uses 45x37.5mm BGA 1964, and the other mobile processors
Raptor_Lake
connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead
List of electronic component packaging types
List_of_electronic_component_packaging_types
Processor socket made by Intel
Socket 478 Release date 2001 Designed by Intel Type PGA-ZIF Chip form factors Flip-chip pin grid array (FC-PGA2 or FC-PGA4) Contacts 478 (not to be confused
Socket_478
36-bit mainframe computer (1964–1966)
its re-implementation using modern silicon transistors and the newer Flip-Chip module packaging to produce the PDP-10. The instruction sets of the two
PDP-6
36-bit computer by Digital (1966–1983)
KA10, introduced in 1968. It uses discrete transistors packaged in DEC's Flip-Chip technology, with backplanes wire-wrapped via a semi-automated manufacturing
PDP-10
layers. MIL-STD-883 methods 2011.9 destructive bond pull test and 2031.1 flip chip pull off test apply, as well as JEDEC JESD22-B109. Partial coring may
Pull_off_test
Integrated circuit composed of several vertically stacked chips
rely on traditional interconnection methods such as wire bonding and flip chip to achieve vertical stacking. 3D packaging can be divided into 3D system
Three-dimensional integrated circuit
Three-dimensional_integrated_circuit
CPU socket for AMD CPUs
2023 (2023-09-18) Designed by AMD Manufactured by Lotes Foxconn Type LGA-ZIF Chip form factors Flip-chip Contacts 4844 FSB protocol PCI Express Infinity Fabric Voltage
Socket_SP6
Lau's research interests have included advanced semiconductor packaging, flip chip, chiplet design, heterogeneous integration, co-packaged optics, glass
John_H._Lau
CPU socket for Intel processors
Release date 2008 (18 years ago) Designed by Intel Type LGA-ZIF Chip form factors Flip-chip Contacts 1366 FSB protocol Intel QuickPath Interconnect FSB frequency
LGA_1366
Emerging flat-panel display technology
expensive. There are several methods to manufacture microLED displays. The flip-chip method manufactures the LED on a conventional sapphire substrate, while
MicroLED
Interpreted programming language
CHIP-8 is an interpreted programming language, developed by Joseph Weisbecker on his 1802 microprocessor. It was initially used on the COSMAC VIP and Telmac
CHIP-8
Intel microprocessor
aging servers. Combining the Deschutes core in a flip-chip package with a 512 KB full-speed L2 cache chip from the Pentium II Xeon into a Socket 8-compatible
Pentium_II
GPU for the PlayStation 3
further weakening the BGA connections. The RSX was packaged using a flip-chip process. The underfill material used in early versions had a relatively
RSX_Reality_Synthesizer
Welding process in which joining occurs without melting or heating the interface
"Influence of fabrication parameters on bond strength of adhesively bonded flip-chip interconnects". Journal of Adhesion Science and Technology. 28 (12): 1167–1191
Cold_welding
Interconnect between layers in HDI substrates and PCBs
increased I/Os with smaller footprint areas (e.g. flip-chip packages, chip-scale packages, and direct chip attachments), and on the printed circuit board
Microvia
Semiconductor company in the Netherlands
attach segment making up 82% of the revenue in 2021. The segment includes Flip Chip, Hybrid Bonding as well as Thermo Compression products among others. In
Besi
Intel microprocessor, released in 2023
Retrieved November 10, 2022. "Crafting and Testing the Do-Anything Server Chip". Intel Newsroom (Press release). February 7, 2023. Archived from the original
Emerald_Rapids
Intel CPU socket for servers (released 2016)
2016 (2016) Designed by Intel Manufactured by Lotes Type LGA-ZIF Chip form factors Flip-chip Contacts 3647 FSB protocol Intel UPI DMI 3.0 PCI Express Processor
LGA_3647
Occupations in the semiconductor industry
technician Wafer fabrication operator Assembly engineer Die-attach technician Flip-chip process engineer Packaging engineer Packaging technician Semiconductor
List of semiconductor occupations
List_of_semiconductor_occupations
Intel CPU socket
2020 (2020-04-18) Designed by Intel Manufactured by Lotes Type LGA-ZIF Chip form factors Flip-chip Contacts 4189 FSB protocol PCI Express Processors Cooper Lake
LGA_4189
ISBN 978-0-08-044554-0, retrieved 2025-07-26 Lau, John H. (2024), "Flip Chip Technology", Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology, Singapore:
B-staging
Topics referred to by the same term
incorrectly referred to as the C4 chip) Controlled collapse chip connection or flip chip, a method for interconnecting semiconductor devices VIA C4, a
C4
Intel desktop CPU socket
connect two graphics cards. Some motherboard manufacturers use Nvidia's NF200 chip to allow even more graphics cards to be used. DMI for communication with
LGA_1156
Minicomputer product line
to about $189,000 in 2025). It uses diode–transistor logic packaged on flip chip cards in a machine about the size of a small household refrigerator. It
PDP-8
CPU socket for AMD CPUs
2022 (2022-11-10) Designed by AMD Manufactured by Lotes Foxconn Type LGA-ZIF Chip form factors Flip-chip Contacts 6096 FSB protocol PCI Express Infinity Fabric Voltage
Socket_SP5
Cooling using a circulating liquid as a heat-exchange medium
ISBN 9781118324066. Tong, Ho-Ming; Lai, Yi-Shao; Wong, C. P. (2013). Advanced Flip Chip Packaging. Dordrecht: Springer Science & Business Media. pp. 447. ISBN 9781441957689
Liquid_cooling
Intel desktop CPU socket
introduces a new method of connecting the heat dissipation interface to the chip surface and motherboard. With LGA 775, the heat dissipation interface is
LGA_775
Temperature regulation of diodes
of the LED dramatically improves the LED’s lifetime. Flip chip – concept is similar to flip-chip in package configuration widely used in the silicon integrated
Thermal management of high-power LEDs
Thermal_management_of_high-power_LEDs
CPU socket from Intel
Socket G1 Type rPGA Chip form factors Flip-chip pin grid array Contacts 988 FSB protocol DMI FSB frequency 2.5GT/s Voltage range Max. 1.4 V (core) Max
Socket_G1
CPU socket for AMD processors with Zen and Excavator architectures
Retrieved 2024-01-08. Bonshor, Gavin. "AMD Announces New Desktop Zen 3 Chips With 2 New APUs and the Ryzen 7 5700X3D". www.anandtech.com. Archived from
Socket_AM4
CPU socket for AMD Athlon low-cost processors
socket. AMD's first compatible CPUs, designated as APUs, are 4 socketable chips in the Kabini family of the Jaguar microarchitecture, marketed under the
Socket_AM1
Japanese manga series
Oregon. The name of that river was used as a codename for the 866 MHz Flip Chip Pin Grid Array (FCPGA) Pentium III (P3-850) microprocessor, which was
Yu-Gi-Oh!_R
Intel CPU interface
Socket M Type PGA-ZIF Chip form factors Flip-chip pin grid array Contacts 478 (not to be confused with the older Socket 478 or the similar Socket 479)
Socket_M
Means of packaging an integrated circuit
the die, instead of the die being attached to it and reflowed using the flip chip method. This is also true in fan-in WLSCP packages. In both cases, the
Wafer-level_packaging
CPU socket for HEDT AMD CPUs
server socket does not require a chipset, instead utilizing a system-on-a-chip design, TR4 and its successor HEDT sockets require a chipset to unlock the
Socket_TR4
CPU socket for AMD CPUs
2017 (2017-06-20) Designed by AMD Manufactured by Lotes Foxconn Type LGA-ZIF Chip form factors Flip-chip Contacts 4094 FSB protocol PCI Express, Infinity Fabric Voltage
Socket_SP3
Distinguishing characteristic of a program
use wire wrap, as well as being the first to use the proprietary DEC Flip-Chip module which was invented in the same year. Feature also applies to concepts
Software_feature
CPU socket for AMD workstation CPUs
While Socket SP3 doesn't require a chipset, instead utilizing a system-on-a-chip design, Socket sWRX8 requires a chipset to provide improved connectivity
Socket_sWRX8
Intel microprocessor, released in 2023
(XCC). Multi-chiplet chip with four tiles linked by 2.5D Embedded Multi-die Interconnect Bridges. Each tile is a 400mm2 system on a chip, providing both compute
Sapphire_Rapids
Method of imaging magnetic fields at microscopic scales
Sullivan. Failure Analysis of Short Faults on Advanced Wire-bond and Flip-chip Packages with Scanning SQUID Microscopy (PDF). IRPS 2004. doi:10.31399/asm
Scanning_SQUID_microscopy
Socket 495 Type PGA-ZIF Chip form factors Flip-chip pin grid array (FC-PGA2) Contacts 495 FSB protocol AGTL+ Voltage range 1.6-1.7V Processors Intel Pentium
Socket_495
CPU socket
Release date 1998 Designed by Intel Type PGA-ZIF Chip form factors Plastic pin grid array (PPGA) and Flip-chip pin grid array (FC-PGA and FC-PGA2) Contacts
Socket_370
2020 family of multi-core microprocessors by IBM
three flip-chip plastic land grid array (FC-PLGA) packages: one single chip module (SCM) and two dual-chip modules (DCM and eSCM). SCM, single chip module
Power10
CPU socket for Intel mobile processors
Socket G2 aka FCPGA988 Type rPGA Chip form factors Flip-chip pin grid array Contacts 988 FSB protocol DMI FSB frequency 2.5 GT/s, 4.8 GT/s Voltage range
Socket_G2
Intel CPU socket
LGA 2066 Type LGA Chip form factors Flip-chip land grid array (FCLGA) Contacts 2066 FSB protocol Intel QPI DMI 3.0 Processors Kaby Lake-X Skylake-X Skylake-W
LGA_2066
2019 mobile phone model
similar design to the 2760/2780, called the Nokia 2660 Flip, which is built on a Unisoc chip and runs Series 30+. Both of these models have also been
Nokia_2720_Flip
IBM hybrid circuit technology introduced in 1964
announced in 1965. IBM chose to design custom hybrid circuits using discrete, flip chip-mounted, glass-encapsulated transistors and diodes, with silk-screened
Solid_Logic_Technology
(Single Edge Contact cartridge 2) processor package, 370-pin FC-PGA (flip-chip pin grid array) package System Bus clock rate 100 MHz (E-models), 133 MHz
List_of_Intel_processors
United States defense standard
destructive lead pull test 2029 Ceramic chip carrier bond strength 2030 Ultrasonic inspection of die attach 2031.1 Flip chip pull-off test 2032.1 Visual inspection
MIL-STD-883
Series of video cards
manufacturing of the core was the use of the flip-chip packaging, a technology not used previously on video cards. Flip chip packaging allows far better cooling
Radeon_9000_series
System-on-a-chip designed by Apple Inc.
A5X uses a metal heat spreader (along with thermal paste) to cover the flip chip underneath. The die takes up 162.94 mm2 of area—a 36.5% increase in area
Apple_A5X
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