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Integrated circuit package that is no or barely larger than the die it contains
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for chip-size packaging. Since
Chip-scale_package
standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1
List of electronic component packaging types
List_of_electronic_component_packaging_types
Electronic circuit formed on a small, flat piece of semiconductor material
processing chips in home appliances are foundational to contemporary society due to their small size, low cost, and versatility. Very-large-scale integration
Integrated_circuit
Integrated circuit packaging method
Ball Grid Array PSfcCSP: refers to the bottom package: Package Stackable Flip Chip Chip Scale Package In 2001, a Toshiba research team including T. Imoto
Package_on_a_package
Means of packaging an integrated circuit
before the packaging components are attached. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically
Wafer-level_packaging
Connection method for surface-mounted chips
array, chip-scale package, and flip chip packages generally use solder balls. After the solder balls are used to attach an integrated circuit chip to a
Solder_ball
Technique that flips a microchip upside down to connect it
"Solder Bump Flip Chip". Flipchips.com. Archived from the original on 2014-10-16. "Wafer Level Chip Scale Package by the Wafer Level Package Development Team"
Flip_chip
Electronic component
a package, or system in package (SiP), is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate
System_in_a_package
Manufacturing process used to create integrated circuits
however, Flip-chip packaging can be used to place bond pads across the entire surface of the die. Chip scale package (CSP) is another packaging technology
Semiconductor device fabrication
Semiconductor_device_fabrication
Spicy snack food challenge
death in 2023. During the fall season from 2016 to 2023, the chip was sold in various packaging before being declared "sold out". The formulation changed
One_Chip_Challenge
Taiwanese manufacturer of semiconductor testing products
The packaging services include fan-out wafer-level packaging (FO-WLP), wafer-level chip-scale packaging (WL-CSP), flip chip, 2.5D and 3D packaging, system
ASE_Group
Final stage of semiconductor device fabrication
technology Surface-mount technology Chip carrier Pin grid array Flat package Small outline integrated circuit Chip-scale package Ball grid array Transistor, diode
Integrated_circuit_packaging
Integrated circuit package with contacts on all 4 sides, on the underside of the package
package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made
Flat_no-leads_package
Thermoelectric Copper Device
flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of
Thermal_copper_pillar_bump
Integrated circuit composed of several vertically stacked chips
via (TMV™) bottom package technology for next generation high density PoP applications. "Advancements in Stacked Chip Scale Packaging (S-CSP), Provides
Three-dimensional integrated circuit
Three-dimensional_integrated_circuit
Small form factor atomic clock
A chip scale atomic clock (CSAC) is a compact, low-power atomic clock fabricated using techniques of microelectromechanical systems (MEMS) and incorporating
Chip-scale_atomic_clock
Nigerian professor, inventor, engineer, author, and entrepreneur
accelerometer for the iPhone and created the company's first wafer level chip scale package for inertial sensor. He is a player in the U.S. semiconductor industry
Ndubuisi_Ekekwe
Planned semiconductor fabrication plant
three manufacturers worldwide who are producing sub-5 nanometer (nm) chips at scale, the other two being TSMC and Samsung Electronics. In April 2026, Musk
Terafab
Micro-electronic component
LPDDR, and flash storage chips, such as eUFS or eMMC, which may be stacked directly on top of the SoC in a package-on-package (PoP) configuration or placed
System_on_a_chip
Interconnect between layers in HDI substrates and PCBs
footprint areas (e.g. flip-chip packages, chip-scale packages, and direct chip attachments), and on the printed circuit board and package substrate level, to
Microvia
Phenomenon caused by defective LED streetlights
modules, including microscopy showing cracks and adhesion failure in chip-scale package LEDs, which shift spectral output toward blue-violet as phosphor coverage
2020s purpling of streetlights
2020s_purpling_of_streetlights
System of building very large integrated circuit networks
Wafer-scale integration (WSI) is a system of building very large integrated circuit (commonly called a "chip") networks from an entire silicon wafer to
Wafer-scale_integration
Topics referred to by the same term
and statistical data analysis Carriage service provider Chip-scale package, or chip-size package Client-side prediction, a network programming technique
CSP
Group of 32-bit RISC processor cores
the Cortex-M0+ type (as of 2014, smallest at 1.6 mm by 2 mm in a chip-scale package is Kinetis KL03). On 21 June 2018, the "world's smallest computer'"
ARM_Cortex-M
Tests performed immediately after semiconductor wafer fabrication
recognized the ink dot. For today's multi-die packages such as stacked chip-scale package (SCSP) or system in package (SiP) – the development of non-contact
Wafer_testing
Multiple electronic componets in a single package
assembly. Typical packages for integrated passives are SIL (Standard In Line), SIP or any other packages (like DIL, DIP, QFN, chip-scale package/CSP, wafer level
Integrated_passive_devices
Topics referred to by the same term
Association, United States association Polymer Stud Grid Array, a chip scale package This disambiguation page lists articles associated with the title
PSGA
Electrical connection
to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and
Through-silicon_via
Type of integrated circuit packaging
flip chip mounting. Typically, PGA packages use wire bonding when the chip is mounted on the pinned side, and flip chip construction when the chip is on
Pin_grid_array
Type of electronic component package
could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route
Dual_in-line_package
Surface mount integrated circuit package with "gull wing" pins extending from all sides
components on the same printed circuit board (PCB). A high package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger
Quad_flat_package
Sound generation IC
package of the same name. The AY-3-8912 is the same chip in a 28-pin package, with parallel port B simply not connected to any pins. Smaller packages
General_Instrument_AY-3-8910
System-on-chip processors designed by Apple Inc.
Apple silicon is a series of system on a chip (SoC) and system in a package (SiP) integrated circuits designed by Apple Inc., mainly using the ARM CPU
Apple_silicon
Flash storage specification
Samsung unveiled embedded UFS (eUFS) v3.0 and uMCP (UFS-based multi-chip package) solutions. On 30 January 2020 JEDEC published version 3.1 of the UFS
Universal_Flash_Storage
Semiconductor device manufacturer
is now[when?] being shut down. The site also has a "Wafer Level Chip Scale Packaging" accreditation for eSIM ICs. In 1988, a small group of employees
STMicroelectronics
Decrease in integrated circuit availability
A chip shortage, also referred to as semiconductor shortage or chip famine, is a phenomenon in the integrated circuit (chip) industry when demand for
Chip_shortage
Refinishing operation of an electronic printed circuit board assembly
initially positioned totally correctly. Ball grid arrays (BGA) and chip scale packages (CSA) present special difficulties for testing and rework, as they
Rework_(electronics)
Type of random-access memory
transactions at full bandwidth Point-to-point data interconnect Chip scale package packaging Dynamic request scheduling Early-read-after-write support for
XDR_DRAM
System-on-a-chip series designed by Apple Inc.
Architecture, which bonds two dies into a single SoC using advanced packaging. All M5 chips share a high-performance CPU core that Apple calls the "super core"
Apple_M5
Moroccan high-tech manufacturing company
packaging, wafer-level optics and wafer-level cameras. In July 2009, Nemotek Technologie announced a new WLP technology, which provides a true chip-scale
Nemotek_Technologie
American technology company
prior to its initial public offering in 2003. Tessera developed chip-scale packaging technologies that were broadly licensed in the semiconductor industry
Xperi
European legislative proposal
The European Chips Act (ECA), also known as simply the Chips Act, is a legislative package to encourage semiconductor production in the European Union
European_Chips_Act
Academic journal
research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication
IEEE Transactions on Advanced Packaging
IEEE_Transactions_on_Advanced_Packaging
Packaging technology for integrated circuits
(eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting
Embedded wafer level ball grid array
Embedded_wafer_level_ball_grid_array
3D graphics chip used in Super Nintendo games
Yoshi's Island uses the chip for 2D graphics effects like sprite scaling and stretching. Game cartridges that contain a Super FX chip have additional contacts
Super_FX
Device that compares two voltages or currents
example, nano-powered comparators in space-saving chip-scale packages (UCSP), DFN or SC70 packages such as MAX9027, LTC1540, LPV7215, MAX9060, and MCP6541
Comparator
Defunct American semiconductor company
M-Series fan-out manufacturing process and will expand production of chip-scale packages using this technology. Cypress named Hassane El-Khoury its president
Cypress_Semiconductor
Chinese Semiconductor company
combining CMOS image sensors, chip scale packaging processes, (CSP) and wafer-level optics (WLO). These fully integrated chip products have camera functionality
OmniVision_Technologies
Degradation of solder due to deformation under cyclic loading
G. S., "Solder joint fatigue models: review and applicability to chip scale packages". Microelectronics Reliability 40 (2000) 231-244, 1999. Steinberg
Solder_fatigue
Integrated circuit used for timer applications
555 package incorporated the equivalent of 25 transistors, 2 diodes, and 15 resistors on a silicon chip packaged into an 8-pin dual in-line package (DIP-8)
555_timer_IC
Small lens, generally with a diameter less than a millimetre
methodology can now be used to fabricate wafer-level optical elements in a chip scale package. The result is a wafer-level camera module that measures .575 mm x
Microlens
American semiconductor company
that it can patch its chips together to create what would be the largest-ever computing cluster for AI computing. A Wafer-Scale Cluster can connect up
Cerebras_Systems
Computer processor contained on an integrated-circuit chip
limitations on the number of transistors that can be put onto one chip, the number of package terminations (pins) that can connect the processor to other parts
Microprocessor
Israeli-American multinational supplier of computer networking products
acquired assets of XLoom Communications Ltd., including opto-electric chip-scale packaging, and some of XLoom's technology personnel. In July 2013, Mellanox
Mellanox_Technologies
GPU used in the Xbox 360
Qualcomm Adreno 200) and Z460 graphics chips. The Xenos introduced new design ideas that were later adopted in the TeraScale microarchitecture, such as the unified
Xenos_(graphics_chip)
American engineer of Indian origin
Performance Scaling (UCLA CHIPS). Between 2023 and 2024, he served on assignment from UCLA as the Director of the National Advanced Packaging Manufacturing
Subramanian_Iyer
Instrument to measure the weight of an object
such as kilograms. Scales and balances are widely used in commerce, as many products are sold and packaged by mass. The balance scale is such a simple device
Weighing_scale
package (QIP or QIL), is an electronic component package with a rectangular housing and four parallel rows of electrical connecting pins. The package
Quad_in-line_package
2017 family of multi-core microprocessors by IBM
predominantly run Linux. With POWER9, chips made for Scale Out can support directly attached memory, while Scale Up chips are intended for use with machines
POWER9
American semiconductor designing company
Lithography (CEBL), Secure Chip ID, Advanced Packaging Interposers, Photonics, and other applications where precise, nanometer-scale features are required
Multibeam_Corporation
Method for producing electronic circuits
connectors Chip carrier Electronics Electronics manufacturing services List of electronics package dimensions List of electronic component packaging types
Surface-mount_technology
American academic
professor of mechanical engineering and director of the Small Scale Systems Packaging Center at Binghamton University in Binghamton, New York. Sammakia
Bahgat_G._Sammakia
Microprocessor
data path chip and a control chip in ceramic leadless packages mounted on a single ceramic hybrid dual inline package (DIP). The control chip incorporated
DEC_J-11
Semiconductor factory
packaging facilities, and a research and development center. As of 2025, the first fab has been completed and is producing four-nanometer (nm) chips.
TSMC_Arizona
4-bit microprocessor
chip marked both a technological and economic milestone in computing. The 4-bit 4004 CPU was the first significant commercial example of large-scale integration
Intel_4004
for sprite scaling, rotation, and stretching. This chip has at least four revisions, first as a surface mounted chip labeled "MARIO CHIP 1" (Mathematical
List of Super NES enhancement chips
List_of_Super_NES_enhancement_chips
Unpackaged integrated circuit
IC operational amplifier 3 1/2 digit single-chip A/D converter SN7400 Quad NAND gate in flat pack package. 1965. CD-ROM drive head die An old security
Die_(integrated_circuit)
Sliced dried beef product
Chipped beef is a form of pressed, salted and dried beef that has been sliced into thin pieces. Some makers smoke the dried beef for more flavor. The
Chipped_beef
American semiconductor company
metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; metal interconnect
Onto_Innovation
of the finished device chip – an integrated circuit; may refer to either a bare die or a packaged device chip carrier – a package built to contain an integrated
Glossary of microelectronics manufacturing terms
Glossary_of_microelectronics_manufacturing_terms
Series of systems-on-a-chip designed by Apple
of the processor, aka memory on package (MOP). The SoC and DRAM chips are mounted together in a system-in-a-package design. 8 GB and 16 GB configurations
Apple_M1
Microprocessor core
designed for low power consumption, using 2.4 W at 533 MHz. The chip comes in the 35 mm PBGA package. The IOP line of processors is designed to allow computers
XScale
System-on-a-chip designed by Apple Inc.
The Apple M4 is a series of ARM-based systems on a chip made by Apple, part of the Apple silicon series, including a central processing unit (CPU), a graphics
Apple_M4
Type of memory used on processors that require high transfer rate memory
some CPUs utilize HBM as on-package cache or RAM, such as the NEC SX-Aurora TSUBASA and Fujitsu A64FX. The first HBM memory chip was produced by SK Hynix
High_Bandwidth_Memory
Small computer on a single integrated circuit
microcontroller, the PROM was usually of identical type as the EPROM, but the chip package had no quartz window; because there was no way to expose the EPROM to
Microcontroller
American system-on-chip technology company
headquartered in Campbell, California. It develops the network-on-chip (NoC) IP, system-on-chip (SoC) integration automation software and semiconductor hardware
Arteris
Low speed communications bus
Example UNI/O devices in SOT-23 and wafer level chip scale packages sitting on the face of a U.S. penny
UNI/O
Smart payment card standard
Payment cards which comply with the EMV standard are often called chip and PIN or chip and signature cards, depending on the authentication methods employed
EMV
Type of surface-mount packaging for integrated circuits
socket LGA 7529 - Intel E-core Xeon (Sierra Forest) socket Chip carrier Dual in-line package (DIP) Pin grid array (PGA) Ball grid array (BGA) Compression
Land_grid_array
American animated television series
Chip 'n Dale: Rescue Rangers is an American animated adventure comedy television series created by Tad Stones and Alan Zaslove and produced by Walt Disney
Chip 'n Dale: Rescue Rangers (TV series)
Chip_'n_Dale:_Rescue_Rangers_(TV_series)
United States legislation promoting the semiconductor industry and public basic research
announced the next day as a chip design lab in Sunnyvale, California. In January 2025, the third flagship site, a lab for chip packaging, was announced as Arizona
CHIPS_and_Science_Act
Uniform polymer particles
Assesment [sic] of Electronics. Ugelstad-particles Ball Grid Array and Chip Scale Packaging". ResearchGate. Rangnes 1997:4–5 In 1977: The Norwegian Institute
Microbead_(research)
Analog integrated circuit
only one output goes on. The device is packaged in an 18 pin dual in-line package or in a surface mount leadless chip carrier. List of LM-series integrated
LM3914
Class of digital circuits
and plastic dual in-line package(s) and in flat-pack form. Some TTL chips are now also made in surface-mount technology packages. TTL became the foundation
Transistor–transistor_logic
Electrical connection consisting of a length of wire or a metal pad
circuit packaging are made by placing a silicon chip on a lead frame, wire bonding the chip to the metal leads of the lead frame, and covering the chip with
Lead_(electronics)
Electronic non-volatile computer storage device
package and in 2008. In 2010, Toshiba used a 16-layer 3D IC for their 128 GB THGBM2 flash package, which was manufactured with 16 stacked 8 GB chips.
Flash_memory
Microprocessor with more than one processing unit
cores onto a single IC die, known as a chip multiprocessor (CMP), or onto multiple dies in a single chip package. As of 2024, the microprocessors used
Multi-core_processor
Advanced packaging technique
about 18 times smaller than that of a bridge-chip because bridge-chip bumps also include organic package vias. The reduced capacitance and shorter interconnects
2.5D_integrated_circuit
Hardware cache of a central processing unit
typically the largest part by chip area. The size of the cache needs to be balanced with the general desire for smaller chips which cost less. Some modern
CPU_cache
dies within the integrated circuit (IC) package. In order to control the optical signals inside the small IC package properly, microelectromechanical system
Optical_interconnect
GPU microarchitecture designed by Nvidia
package totals 208 billion transistors. Those two GB100 dies are placed on top of a silicon interposer produced using TSMC's CoWoS-L 2.5D packaging technique
Blackwell_(microarchitecture)
British semiconductor company
first chip, called the Colossus GC2, a "16 nm massively parallel, mixed-precision floating point processor", that became available in 2018. Packaged with
Graphcore
China businesswoman and semiconductor researcher
across large-scale system-on-chip design, high-speed analog and mixed-signal circuits, radio frequency design, advanced packaging, power and sensor technologies
He_Tingbo
IBM hybrid circuit technology introduced in 1964
monolithic integrated circuits (resistors now external from the package on the module). Each MST chip holds about five circuits and is the approximate equivalent
Solid_Logic_Technology
Digital image analysis tool
Nathan (November–December 2012). "Designing and Qualifying Chip-Scale Packages" (PDF). Chip Scale Review. 16 (6): 32–35. Serebreni, Maxim; Blattau, Nathan;
Digital image correlation for electronics
Digital_image_correlation_for_electronics
AI accelerator ASIC by Google
of on chip memory, and 4 MiB of 32-bit accumulators taking the results of a 256×256 systolic array of 8-bit multipliers. Within the TPU package is 8 GiB
Tensor_Processing_Unit
electron-beam lithography techniques for chip fabrication, a leap that helped Japan produce more complex semiconductors at scale. By commercialising innovations
Semiconductor industry in Japan
Semiconductor_industry_in_Japan
Intel microprocessor, released in 2023
single package (XCC). Multi-chiplet chip with four tiles linked by 2.5D Embedded Multi-die Interconnect Bridges. Each tile is a 400mm2 system on a chip, providing
Sapphire_Rapids
Machine designed to mimic the human brain
higher-bandwidth inter-chip communications for enhanced scalability, increased capacity per chip, a more compact size due to process scaling, and improved programmability
Cognitive_computer
8-bit microprocessor
a line of very low-cost microprocessors for small-scale embedded systems. The 6507 and 6502 chips use the same underlying silicon layers, and differ
MOS_Technology_6507
CHIP SCALE-PACKAGE
CHIP SCALE-PACKAGE
Female
Thai/Siamese
Thai name NGAM-CHIT means "good heart."
Boy/Male
Shakespearean
Henry VI, Part 2' Lord Scales.
Surname or Lastname
English
English : from Middle English sale ‘hall’, a topographic name for someone living at a hall or manor house, or a metonymic occupational name for someone employed at a hall or manor house.English : from Middle English salwe ‘sallow’ (a tree, a kind of willow), hence a topographic name for someone who lived by a sallow tree, or a habitational name from for example Sale in Greater Manchester, named from the old dative form of this word, in atte sale.French (Salé) : from Old French salé ‘salty’, hence a topographic or occupational name for someone who lived by or worked in a salt marsh, or, in a figurative sense, a nickname for an amusing or witty person.
Boy/Male
British, English
Peddler; Merchant; Diminutive of Chapman
Girl/Female
African, Arabic
Scale
Boy/Male
Muslim
Long of time
Boy/Male
English American Hebrew
Bold; Surname derived from Charles.
Female
Vietnamese
Vietnamese name CHI means "tree branch."
Boy/Male
Hindu, Indian, Marathi
Scale Holder
Surname or Lastname
English (Devon)
English (Devon) : variant of Small.
Boy/Male
American, Australian, British, Christian, English, German, Jamaican
Chipping Sparrow; Man; Strong Man; A Freeman
Boy/Male
English
Peddler; merchant.
Surname or Lastname
English
English : variant spelling of Chinn.Chinese : variant of Jin 1.Chinese : Cantonese variant of Qian.Chinese : variant of Qin 1.Chinese : variant of Qin 2.Chinese : variant of Jin 2.Chinese : variant of Jin 3.Korean : there are four Chinese characters for the surname Chin, representing five clans. At least three of the clans have origins in China; most of them migrated to Korea during the Kory{ou} period (ad 918–1392).
Boy/Male
Vietnamese
Bird.
Surname or Lastname
English
English : variant of Seal 1–4; it is also established as a surname in Ireland.
Male
English
Short form of English Caleb, CALE means "dog" or "rabid."
Female
Japanese
(æµ) Japanese name CHIE means "wisdom."
Boy/Male
Gypsy
Earth.
Boy/Male
English American
Man (from the Old English 'ceorl'). Famous Bearers: American movie star Charles Bronson;...
Boy/Male
Indian
Long of time
CHIP SCALE-PACKAGE
CHIP SCALE-PACKAGE
Surname or Lastname
English (chiefly Midlands)
English (chiefly Midlands) : variant spelling of Heard.
Boy/Male
Tamil
Ravi Kumar | ரவிகà¯à®®à®¾à®°Â
Lord Surya (Sun), Fire
Girl/Female
Bengali, Indian, Marathi
Holy
Boy/Male
German
Noble Wolf; Form of Adalwolf
Boy/Male
Indian, Punjabi, Sikh
Brave Lord
Boy/Male
Gaelic American English Irish
Spirited.
Boy/Male
German American Teutonic English
Gifted ruler. From Theodoric.
Boy/Male
Hindu
God of beauty, God of beauty, Husband of a beautiful wife
Boy/Male
Muslim
Speaker, Talker, Prophet Muhammad
Girl/Female
Hindu, Indian, Telugu
Goddess Lakshmi; Lord Venkateswara
CHIP SCALE-PACKAGE
CHIP SCALE-PACKAGE
CHIP SCALE-PACKAGE
CHIP SCALE-PACKAGE
CHIP SCALE-PACKAGE
imp. & p. p.
of Scale
n.
Scurf on the head. See Scall.
a.
Without scales, or with the scales removed; as, scaled herring.
a.
Composed of scales lying over each other; as, a scaly bulb; covered with scales; as, a scaly stem.
a.
Resembling scales, laminae, or layers.
a.
Having feathers which in form, color, or arrangement somewhat resemble scales; as, the scaled dove.
n.
The graduated series of all the tones, ascending or descending, from the keynote to its octave; -- called also the gamut. It may be repeated through any number of octaves. See Chromatic scale, Diatonic scale, Major scale, and Minor scale, under Chromatic, Diatonic, Major, and Minor.
a.
Resembling a scale; also, covered with scales; scaly.
v. t.
To strip or clear of scale or scales; as, to scale a fish; to scale the inside of a boiler.
n.
A scale insect. (See below.)
a.
Covered or abounding with scales; as, a scaly fish.
n.
A basis for a numeral system; as, the decimal scale; the binary scale, etc.
a.
Mean; low; as, a scaly fellow.
v. t.
To weigh or measure according to a scale; to measure; also, to grade or vary according to a scale or system.
n.
A small appendage like a rudimentary leaf, resembling the scales of a fish in form, and often in arrangement; as, the scale of a bud, of a pine cone, and the like. The name is also given to the chaff on the stems of ferns.
pl.
of Scala
a.
Scale-winged.
v. t.
To deprive of the scalp; to cut or tear the scalp from the head of.
a.
Scurvy; paltry; as, scald rhymers.
n.
Hence, any layer or leaf of metal or other material, resembling in size and thinness the scale of a fish; as, a scale of iron, of bone, etc.