Searches , social queries for POWER ELECTRONIC-SUBSTRATE
Search references for POWER ELECTRONIC-SUBSTRATE. Phrases containing POWER ELECTRONIC-SUBSTRATE
See searches and references containing POWER ELECTRONIC-SUBSTRATE!
Search references for POWER ELECTRONIC-SUBSTRATE. Phrases containing POWER ELECTRONIC-SUBSTRATE
See searches and references containing POWER ELECTRONIC-SUBSTRATE!POWER ELECTRONIC-SUBSTRATE
The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool
Power_electronic_substrate
Electronics module
devices. These power semiconductors (so-called dies) are typically soldered or sintered on a power electronic substrate that carries the power semiconductors
Power_module
Topics referred to by the same term
Direct-buried cable, a kind of electrical cable Direct Bonded Copper, a power electronic substrate Martin Nemley, a member of the American hip hop band Stetsasonic
DBC
Topics referred to by the same term
Direct Copper Bonding, also Direct Bonding Copper, a type of power electronic substrate Direct Carrier Billing, a method of doing digital financial transactions
DCB
American engineered materials company
purchased German based curamik® Electronics, a manufacturer of power electronic substrates. In 2016, Rogers announced that it would move its headquarters
Rogers_Corporation
Paper-like display technology
Many electronic paper technologies hold static text and images indefinitely without electricity. Flexible electronic paper uses plastic substrates and
Electronic_paper
Board to support and connect electronic components
sheet layers of a non-conductive substrate. PCBs are used to connect or "wire" components to one another in an electronic circuit. Electrical components
Printed_circuit_board
Electrical circuit with active components
formed on the same substrate, typically a semiconductor such as doped silicon or (less commonly) gallium arsenide. An electronic circuit can usually
Electronic_circuit
Type of miniature electronic circuit
(e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). A PCB having components on a printed wiring
Hybrid_integrated_circuit
CMOS-based electronic switch
the substrate terminal of the n-channel MOSFET connected to the negative supply potential. When the control input is a logic zero (negative power supply
Transmission_gate
Thin slice of semiconductor used for the fabrication of integrated circuits
In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for
Wafer_(electronics)
Electronic circuit formed on a small, flat piece of semiconductor material
integrated circuit was small ceramic substrates known as micromodules, each containing a single miniaturized electronic component. These modules could be
Integrated_circuit
the analysis. Substrate and mixed-signal analysis techniques can be applied to placement and power distribution synthesis. Electronic Design Automation
Substrate_coupling
Method of circuit board manufacture
The substrate wiring board may include heat-dissipating layers where the mounted devices handle significant power, such as in LED lighting or power semiconductors
Chip_on_board
Calculators powered by built-in solar cells
Solar-powered calculators are hand-held electronic calculators powered by solar cells mounted on the device. They were introduced at the end of the 1970s
Solar-powered_calculator
Multiple electronic componets in a single package
wafer level package/WLP etc.) used in electronic packaging. Integrated passives can also act as a module substrate, and therefore be part of a hybrid module
Integrated_passive_devices
Technique that flips a microchip upside down to connect it
top of a "substrate" which then sits on top of a traditional PCB. The substrate can have a Ball Grid Array (BGA) on its underside. The substrate makes the
Flip_chip
Technology used to produce electronic components
needed. The simplest form to utilise a thick film technology is a module substrate/board, where wiring is manufactured using thick film process. Additionally
Thick-film_technology
Device used for calculations
keys on the third row. In general, a basic electronic calculator consists of the following components: Power source (mains electricity, battery and/or
Calculator
Board for prototype electronic circuits
the mini, half, and full configurations respectively. To provide power to the electronic components, bus strips are used. A bus strip usually contains two
Breadboard
Electronics mimicking skin functionalities
often designed by depositing electronic materials on flexible polymer substrates, thereby relying on an organic substrate to impart favorable mechanical
Electronic_skin
Form of physical vapor deposition
optics to impart the desired reflective and transmissive properties to a substrate and elsewhere in industry to modify surfaces to have a variety of desired
Electron-beam physical vapor deposition
Electron-beam_physical_vapor_deposition
Solid-state electrically operated switch also used as an amplifier
circuits as electronic switches which can be either in an on or off state, both for high-power applications such as switched-mode power supplies and
Transistor
South Korean company
Multi-Layer Ceramic Capacitors (MLCC), Inductors, Resistors, IC Substrate, semiconductor substrates, camera modules, network modules and printed circuit boards
Samsung_Electro-Mechanics
passive components bonded to a substrate IC – see integrated circuit integrated circuit (IC) – a miniature electronic circuit formed by microfabrication
Glossary of microelectronics manufacturing terms
Glossary_of_microelectronics_manufacturing_terms
Chemical semiconductor compound
for applications in optoelectronics, high-power and high-frequency devices. For example, GaN is the substrate that makes violet (405 nm) laser diodes possible
Gallium_nitride
Computerized safety automotive technology
Electronic stability control (ESC), also referred to as electronic stability program (ESP) or dynamic stability control (DSC), is a computerized technology
Electronic_stability_control
Electronic products for everyday use
Consumer electronics, also known as home electronics, are electronic devices intended for everyday household use. Consumer electronics include those used
Consumer_electronics
Method used to apply surface coatings
Classified by type of substrate heating: Hot wall CVD – CVD in which the chamber is heated by an external power source and the substrate is heated by radiation
Chemical_vapor_deposition
Passive electronic component providing electrical resistance
resistor is a passive two-terminal electronic component that implements electrical resistance as a circuit element. In electronic circuits, resistors are used
Resistor
Integrated circuit packaging method
module, MCM), and/or embedded in the substrate. The SiP performs all or most of the functions of an electronic system, and is typically used when designing
System_in_a_package
Device that converts electricity into heat
uniform temperature distribution across a substrate, the circuit design can be optimized by changing the localized power density of the resistor circuit. An
Heating_element
Semiconductor light source
A light-emitting diode (LED) is an electronic component that uses a semiconductor to emit light when current flows through it. Electrons in the semiconductor
Light-emitting_diode
Mounting of electronic devices on flexible plastic substrates
technologies that are used for assembling electronic circuits by mounting electronic components on flexible plastic substrates, such as polyimide, PEEK, or transparent
Flexible_electronics
Final stage of semiconductor device fabrication
good heat conduction). For low-cost, low-powered applications, the die is often glued directly onto a substrate (such as a printed wiring board) using an
Integrated_circuit_packaging
Composite of copper, silver, and diamond
composite material for high power density electronic components Davidson, H. L et al. Copper-diamond composite substrates for electronic components Archived 2011-07-22
Dymalloy
Electrical transmission without physical connection
mobility, convenience, and safety of an electronic device for all users. Wireless power transfer is useful to power electrical devices where interconnecting
Wireless_power_transfer
Electronic switching device
responds to an appropriate input (control signal), an electronic switching device which switches power to the load circuitry, and a coupling mechanism to
Solid-state_relay
Hexagonal lattice made of carbon atoms
hybridization between the d-orbitals of the substrate atoms and π orbitals of graphene, which significantly alter the electronic structure compared to that of free-standing
Graphene
Transmission lines with flat ribbon-like conducting or dielectric lines
transmit along a strip of dielectric, and substrate-integrated waveguide forms a dielectric waveguide within the substrate with rows of posts. These types cannot
Planar_transmission_line
Common transistor type
The 2N7000 is an N-channel, enhancement-mode MOSFET used for low-power switching applications. The 2N7000 is a widely available and popular part, often
2N7000
Thin, flexible sheet of metal
the building blocks of electronic devices. It is used to create conductive traces and interconnections on the insulating substrate, allowing the flow of
Copper_foil
Waveguide formed by posts inserted in a dielectric substrate
A substrate-integrated waveguide (SIW) (also known as post-wall waveguide or laminated waveguide) is a synthetic rectangular electromagnetic waveguide
Substrate-integrated waveguide
Substrate-integrated_waveguide
Method used to relatively precisely remove material in a controlled and fine fashion
to the substrate (silicon wafer) to create directional electric fields near the substrate to achieve more anisotropic etch profiles. The RF power given
Reactive-ion_etching
Thermoelectric Copper Device
cooling power: the further the distance between source and cooler, the more cooling is required. For this reason, the cooling of electronic devices is
Thermal_copper_pillar_bump
Failure mode in MOSFET circuits
resolved by power-down. Consider the n-well structure in the first figure. The n-p-n-p structure is formed by the source of the NMOS, the p-substrate, the n-well
Latch-up
Passive electrical component providing electrical resistance
However, they are used in power supplies and welding controls. They are also in demand for repair of vintage electronic equipment where authenticity
List_of_resistors
Vaporizing laser beam in a vacuum chamber
the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in
Pulsed_laser_deposition
Component that outputs the integral of its input over time
source and the substrate, closing the electric circuit which in part is given by the ion beam. A voltage integrator is an electronic device performing
Integrator
Temperature regulation of diodes
high light flux with an extremely small light emitting substrate, causing concerns with LED power management to be particularly acute. In order to maintain
Thermal management of high-power LEDs
Thermal_management_of_high-power_LEDs
Type of electric circuits
create complete circuits using foldable paper-based substrates. Silk coatings could underpin an electronic devices because it melts away when the device is
Biodegradable_electronics
Advanced packaging technique
routed on this interposer. The interposer is then connected to the package substrate using silicon vias, which provide connections to peripheral hardware such
2.5D_integrated_circuit
Removing the protective cover of an integrated circuit
IHS with the processor package substrate, which is often a specialized printed circuit board often only called a substrate or sometimes an interposer. In
Decapping
Antenna for receiving power
integrated circuit (IC) which is powered by a small rectenna element. When the device is brought near an electronic reader unit, radio waves from the
Rectenna
Technique used to connect a microchip to its package
Markov chains for remaining useful life prediction of wire bonds in power electronic modules". Microelectronics Reliability. 167 115644: 1–12. doi:10.1016/j
Wire_bonding
Computing by new or unusual methods
converting electronic energy to photons and back. All-optical computers aim to eliminate the need for these conversions, leading to reduced electrical power consumption
Unconventional_computing
Chemical compound
grown as 10 kg crystal ingots and sliced into thin wafers as substrates for electronic circuits. Boron oxide is used as an encapsulant to prevent the
Gallium_arsenide
Fabrication at micrometre scales and smaller
usually formed over or in a thicker support substrate. For electronic applications, semiconducting substrates such as silicon wafers can be used. For optical
Microfabrication
Slice of semiconductor grown gradually atop a substrate itself
spintronics, or photovoltaics. The epi layer may be the same material as the substrate, typically monocrystaline silicon, or it may be a silicon dioxide (SoI)
Epitaxial_wafer
Electronic assembly containing multiple integrated circuits that behaves as a unit
and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms
Multi-chip_module
Technique used for printing images onto 3D surfaces
an image being transferred from the cliché via a silicone pad onto a substrate. Pad printing is used for printing on otherwise difficult to print on
Pad_printing
Technology for constructing integrated circuits
mass-produced CMOS consumer electronic product was the Hamilton Pulsar "Wrist Computer" digital watch, released in 1970. Due to low power consumption, CMOS logic
CMOS
Nitride of aluminum
material for III-nitride quantum heterostructures used in high-power and high-frequency electronic devices. AlN exists primarily in the hexagonal wurtzite crystal
Aluminium_nitride
Ways electronic components fail and prevention measures
Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by
Failure of electronic components
Failure_of_electronic_components
Electronic control system
inverters (electronic power converters used to integrate DC renewable resources and storage elements such as photovoltaics and batteries with the power grid)
Phase-locked_loop
Type of field-effect transistor
oxide semiconductor). Most power MOSFETs are made using this technology. Semiconductor sub-micrometer and nanometer electronic circuits are the primary
MOSFET
Material of moderate electrical conductivity
circuits, and others. Silicon is a critical element for fabricating most electronic circuits. Semiconductor devices can display a range of different useful
Semiconductor
Wide-bandgap semiconductor and abrasion-resistant ceramic
LED components: It is a popular substrate for growing GaN devices, and it also serves as a heat spreader in high-power LEDs. The low thermal expansion
Silicon_carbide
Semiconductor substrate technology
device fabrication, where such materials are used for electronic devices which must tolerate high-power, high-frequency, or high-temperature operation. Crystal
Lateral epitaxial overgrowth and pendeo-epitaxy
Lateral_epitaxial_overgrowth_and_pendeo-epitaxy
Device that converts heat flux into electrical energy
nylon substrate. Thermoelectrics represent particular synergy with wearables by harvesting energy directly from the human body creating a self-powered device
Thermoelectric_generator
connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead
List of electronic component packaging types
List_of_electronic_component_packaging_types
Electronic devices created by various printing methods
By electronic-industry standards, these are low-cost processes. Electrically functional electronic or optical inks are deposited on the substrate, creating
Printed_electronics
MOSFET that can handle significant power levels
off-state, the power MOSFET is equivalent to a PIN diode (constituted by the P+ diffusion, the N− epitaxial layer and the N+ substrate). When this highly
Power_MOSFET
Fixed-value capacitor using ceramic
capacitors for power electronic Doorknob style high voltage ceramic capacitor Disc style power ceramic capacitor Tubular or pot style power ceramic capacitor
Ceramic_capacitor
Emission of surface atoms through energetic particle bombardment
energy to the solid, mostly by electronic stopping power, where the electronic excitations cause sputtering. Electronic sputtering produces high sputtering
Sputtering
Two-terminal electronic component
A diode is a two-terminal electronic component that conducts electric current primarily in one direction (asymmetric conductance). It has low (ideally
Diode
Electronic circuit structure
form a barrier to electromagnetic wave propagation of slab modes in the substrate. Additionally if radiation in the air above the board is also to be suppressed
Via_fence
Device that controls current between electrodes
not present. The desire to power electronic equipment using AC mains power faced a difficulty with respect to the powering of the tubes' filaments, as
Vacuum_tube
Reference point in an electrical circuit from which voltages are measured
those cases). In electronic circuit theory, a signal ground is the common ground and reference ground for electric signal; and a power ground is the common
Ground_(electricity)
Diode that emits light from an organic compound
Flat-panel display – Electronic display technology Flexible electronics – Mounting of electronic devices on flexible plastic substrates Flexible organic light-emitting
OLED
Topics referred to by the same term
circuit board, on which electronic components are supported and connected using copper tracks on a non-conductive substrate Series and parallel circuits
Circuit
Special adhesive tape used during microchip manufacture
a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material
Dicing_tape
Electronic Device automation
without the help of a computer. Electronic devices may consist of integrated circuits (ICs), integrated circuit substrates, printed circuit boards (PCBs)
Comparison_of_EDA_software
French manufacturing company
Soitec is a French multinational corporation that manufactures substrates used in the manufacturing of semiconductors. Soitec's semiconductor materials
Soitec
integrity Substrate coupling G.992.1 Signal-to-noise ratio Signal "noise margin | JEDEC". www.jedec.org. Retrieved 2019-03-01. "MIT PowerPoint" (PDF)
Noise_margin
Diamond created by controlled processes
tools and in heat sinks. Electronic applications of synthetic diamond are being developed, including high-power switches at power stations, high-frequency
Synthetic_diamond
Topics referred to by the same term
integrated circuit, a miniaturized electronic circuit combining different semiconductor devices and passive components on a substrate Hybrid mass spectrometer,
Hybrid
Thin layer of material
substrate. Thermal laser epitaxy uses focused light from a continuous-wave laser to thermally evaporate sources of material. By adjusting the power density
Thin_film
Electrical system design based on power distribution
devices, and capacitance between N-well and substrate, occur as implicit decoupling capacitance in a power distribution network. Unfortunately, this implicit
Power_network_design_(IC)
Very small devices that incorporate moving components
(RIE), the substrate is placed inside a reactor, and several gases are introduced. A plasma is struck in the gas mixture using an RF power source, which
MEMS
Engineering process for electronic hardware
IC consists of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography. IC design
Integrated_circuit_design
United States defense standard
microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to
MIL-STD-883
Write once computer memory
gate and substrate of the thin oxide transistor (around 6 V for a 2 nm thick oxide, or 30 MV/cm) to break down the oxide between gate and substrate. The positive
Programmable_ROM
Electronics that can bend and stretch
technologies for building electronic circuits by depositing or embedding electronic devices and circuits onto stretchable substrates such as silicones or polyurethanes
Stretchable_electronics
Phenomenon in solid-state electronic devices
where a carrier is injected from the conducting channel in the silicon substrate to the gate dielectric, which usually is made of silicon dioxide (SiO2)
Hot-carrier_injection
Number of transistors in a device
transistor count is the number of transistors in an electronic device (typically on a single substrate or silicon die). It is the most common measure of
Transistor_count
asymptotic power law in contrast to the usual inverse quartic. The electronic properties of graphene are significantly influenced by the supporting substrate. The
Electronic properties of graphene
Electronic_properties_of_graphene
Device used to produce electricity from light
voltages and currents, such as with MPPTs (maximum power point trackers) or module level power electronic (MLPE) units: microinverters or DC-DC optimizers
Solar_cell
Chemical compound
excellent substrate for epitaxial growth of high-temperature superconductors and many oxide-based thin films. It is particularly well known as the substrate for
Strontium_titanate
Type of electronics manufacturing
marked. Signal traces are routed. Electronic design automation tools usually create clearances and connections in power and ground planes automatically
Printed circuit board manufacturing
Printed_circuit_board_manufacturing
travel, tourism, insurance
POWER ELECTRONIC-SUBSTRATE
POWER ELECTRONIC-SUBSTRATE
POWER ELECTRONIC-SUBSTRATE
POWER ELECTRONIC-SUBSTRATE
POWER ELECTRONIC-SUBSTRATE
POWER ELECTRONIC-SUBSTRATE
POWER ELECTRONIC-SUBSTRATE
POWER ELECTRONIC-SUBSTRATE
POWER ELECTRONIC-SUBSTRATE
travel, tourism, insurance